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 HDMI Receiver Port Protection and Interface Device CM2031
Features
* * * * * * * * * * * * HDMI 1.3 compliant Supports thin dielectric and 2-layer boards Minimizes TMDS skew with 0.05pF matching 2 Long HDMI cable support with integrated I C accelerator Active termination and slew rate limiting for CEC Supports direct connection to CEC microcontroller 2 Integrated I C level shifting to CMOS level including low logic level voltages Integrated 8kV ESD protection and backdrive protection on all external I/O lines Supports active and passive control of hot plug detect signal 2 Multiport I C support eliminates need for analog mux on DDC lines Simplified layout with matched 0.5mm trace spacing RoHS-compliant, lead-free packaging
Product Description
The CM2031 HDMI Receiver Port Protection and Interface Device is specifically designed for next generation HDMI Sink interface protection.
An integrated package provides all ESD, slew rate limiting on CEC line, level shifting/isolation and backdrive protection for an HDMI port in a single 38Pin TSSOP package. The CM2031 part is specifically designed to provide the designer with the most reliable path to HDMI 1.3 CTS compliance.
Applications
* * PC and consumer electronics Digital TV, PC monitors and projectors
(c)2010 SCILLC. All rights reserved. May 2010 - Rev. 5
Publication Order Number: CM2031/D
CM2031
Electrical Schematic
5V_SUPPLY TMDS_D2+ TMDS_GND TMDS_D2TMDS_D1+ TMDS_GND TMDS_D1TMDS_D0+ TMDS_GND TMDS_D0TMDS_CK+ TMDS_GND TMDS_CK-
5V_SUPPLY LV_SUPPLY LV_SUPPLY
5V_SUPPLY
DYNAMIC PULLUP DDC_CLK_OUT
DDC_DAT_IN
DYNAMIC PULLUP DDC_DAT_OUT
DDC_CLK_IN
CMOS/I2C
LEVEL SHIFT
CMOS/I2C
LEVEL SHIFT
5V_SUPPLY
CE_SUPPLY
HOTPLUG_DET_IN
CE_SUPPLY
1k HOTPLUG_DET_OUT CE_REMOTE_IN
ACTIVE SLEW RATE LIMITING CE_REMOTE_OUT
P ACKAGE / PINOUT DIAGRAM
TOP VIEW
5V_SUPPLY L _SUPPLY V GND TMDS_D2+ TMDS_GND TMDS_D2- TMDS_D1+ TMDS_GND TMDS_D1- TMDS_D0+ TMDS_GND TMDS_D0- TMDS_CK+ TMDS_GND TMDS_CK- CE_REMO TE_IN DDC_CLK_IN DDC_DA _IN T HOT PLUG_DET_IN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 N/C CE_SUPPLY GND TMDS_D2+ TMDS_GND TMDS_D2- TMDS_D1+ TMDS_GND TMDS_D1- TMDS_D0+ TMDS_GND TMDS_D0- TMDS_CK+ TMDS_GND TMDS_CK- CE_REMO TE_OUT DDC_CLK_OUT DDC_DAT _OUT HOT PLUG_DET_OUT
Note: This drawing is not to scale.
38-PIN TSSOP PACKAGE
Rev. 5 | Page 2 of 18 | www.onsemi.com
CM2031
PIN DESCRIPTIONS
PINS 4, 35 6, 33 7, 32 9, 30 10, 29 12, 27 13, 26 15, 24 16 23 17 22 18 21 19 20 2 37 1 38 3, 5, 8, 11, 14, 25, 28, 31, 34, 36 NAME TMDS_D2+ TMDS_D2- TMDS_D1+ TMDS_D1- TMDS_D0+ TMDS_D0- TMDS_CK+ TMDS_CK- CE_REMOTE_IN CE_REMOTE_OUT DDC_CLK_IN DDC_CLK_OUT DDC_DAT_IN DDC_DAT_OUT HOTPLUG_DET_IN ESD Level 8kV 8kV 8kV 8kV 8kV 8kV 8kV 8kV 2kV 8kV 2kV 8kV 2kV 8kV 2kV
3 3 3 3 3 3 3 3 4 3 4 3 4 3 4 3
DESCRIPTION TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection.
1 1 1 1 1 1 1 1
CE_SUPPLY referenced logic level in. 5V_SUPPLY referenced logic level out plus 10pF ESD. LV_SUPPLY referenced logic level in. 5V_SUPPLY referenced logic level out plus 10pF ESD. LV_SUPPLY referenced logic level in. 5V_SUPPLY referenced logic level out plus 10pF ESD. LV_SUPPLY referenced logic level in. 5V_SUPPLY referenced logic level out plus 10pF ESD. A 0.1F bypass ceramic capacitor is recommended on this pin.
2
HOTPLUG_DET_OUT 8kV LV_SUPPLY CE_SUPPLY 5V_SUPPLY N/C GND / TMDS_GND 2kV 2kV 2kV N/A N/A
4 4,2 4
Bias for CE / DDC / HOTPLUG level shifters. CEC bias voltage. Previously CM2020 ESD_BYP pin. Current source for 5V_OUT, VREF for DDC I C voltage references, and bias for 8kV ESD pins. N/C GND reference.
2
Note 1: These 2 pins need to be connected together in-line on the PCB. See recommended layout diagram. Note 2: This output can be connected to an external 0.1F ceramic capacitor/pads to maintain backward compatibility with the CM2020. Note 3: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V, 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1F ceramic capacitor connected to GND. Note 4: Human Body Model per MIL-STD-883, Method 3015, CDISCHARGE=100pF, RDISCHARGE=1.5k, 5V_SUPPLYand LV_SUPPLY within recommended operating conditions, GND=0V, 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1F ceramic capacitor connected to GND. Note 5: These pins should be routed directly to the associated GND pins on the HDMI connector with single point ground vias at the connector
Rev. 5 | Page 3 of 18 | www.onsemi.com
CM2031
Backdrive Protection and Isolation
Backdrive current is defined as the undesirable current flow through an I/O pin when that I/O pin's voltage exceeds the related local supply voltage for that circuitry. This is a potentially common occurrence in multimedia entertainment systems with multiple components and several power plane domains in each system. For example, if a DVD player is switched off and an HDMI connected TV is powered on, there is a possibility of reverse current flow back into the main power supply rail of the DVD player from pull-ups in the TV. As little as a few milliamps of backdrive current flowing back into the power rail can charge the DVD player's bulk bypass capacitance on the power rail to some intermediate level. If this level rises above the power-on-reset (POR) voltage level of some of the integrated circuits in the DVD player, then these devices may not reset properly when the DVD player is turned back on. If any SOC devices are incorporated in the design which have built-in level shifter and/or ESD protection structures, there can be a risk of permanent damage due to backdrive. In this case, backdrive current can forward bias the on-chip ESD protection structure. If the current flow is high enough, even as little as a few milliamps, it could destroy one of the SOC chip's internal DRC diodes, as they are not designed for passing DC. To avoid either of these situations, the CM2031 was designed to block backdrive current, guaranteeing less than 5A into any I/O pin when the I/O pin voltage exceeds its related operating CM2031 supply voltage.
Figure 1. Backdrive Protection Diagram.
Display Data Channel (DDC) lines
The DDC interface is based on the I C serial bus protocol for EDID configuration. DYNAMIC PULLUPS Based on the HDMI specification, the maximum capacitance of the DDC line can approach 800pF (50pF from source, 50pF from sink, and 700pF from cable). At the upper range of capacitance values (i.e. long cables), it 2 becomes impossible for the DDC lines to meet the I C timing specifications with the minimum pull-up resistor of 1.5k (at the source).
2
Rev. 5 | Page 4 of 18 | www.onsemi.com
CM2031
For this reason, the CM2031 was designed with an internal I C accelerator to meet the AC timing specification even with very long and non-compliant cables. The internal accelerator works with the source pull-up and the local 47k pullup to increase the positive slew rate of the DDC_CLK_OUT and DDC_DAT_OUT lines whenever the sensed voltage level exceeds 0.3*5V_SUPPLY (approximately 1.5V). This provides faster overall risetime in heavily loaded situations without overloading the 2 mutli-drop open drain I C outputs elsewhere. DYNAMIC PULLUPS (CONT'D)
2
Figure 2. Dynamic DDC Pullups (Discrete - Top, CM2031 - Bottom; 3.3V ASIC - Left, 5V Cable - Right.) Figure 2 demonstrates the "worst case" operation of the dynamic CM2031 DDC level shifting circuitry (bottom) against a discrete NFET common-gate level shifter circuit with a typical 1.5k pullup at the source (top.) Both are shown driving an off-spec, but unfortunately readily available 31m HDMI cable which exceeds the 700pF HDMI specification. Some widely available HDMI cables have been measured at over 4nF. When the standard I/OD cell releases the NFET discrete shifter, the risetime is limited by the pullup and the parasitics of the cable, source and sink. For long cables, this can extend the risetime and reduce the margin for reading a valid "high" level on the data line. In this case, an HDMI source may not be able to read uncorrupted data and will not be able to initiate a link. With the CM2031's dynamic pullups, when the ASIC driver releases its DDC line and the "OUT" line reaches at least 0.3*VDD (of 5V_SUPPLY), then the "OUT" active pullups are enabled and the CM2031 takes over driving the cable until the "OUT" voltage approaches the 5V_SUPPLY rail. The internal pass element and the dynamic pullups also work together to damp reflections on the longer cables and keep them from glitching the local ASIC. I C LOW LEVEL SHIFTING In addition to the Dynamic Pullups described in the previous section, then CM2031 also incorporates improved 2 I C low-level shifting on the DDC_CLK_IN and DDC_DAT_IN lines for enhanced compatibility. Typical discrete NFETs level shifters can advertise specifications for low RDS[on], but usually state relatively high V[GS] test parameters, requiring a 'switch' signal (gate voltage) as high as 10V or more. At a sink current of
2
Rev. 5 | Page 5 of 18 | www.onsemi.com
CM2031
4mA for the ASIC on DDC_XX_IN, the CM2031 guarantees no more than 140mV increase to DDC_XX_OUT, even with a switching control of 2.5V on LV_SUPPLY. Additionally, when I C devices are driving the external cable, an internal pulldown on DDC_XX_IN guarantees that the VOL seen by the ASIC on DDC_XX_IN is equal to or lower than DDC_XX_OUT. Multiport DDC Multiplexing
2
Additionally, by switching LV_SUPPLY, the DDC/HPD blocks can be independently disabled by engaging their inherent "backdrive" protection. This allows N:1 multiplexing of the lowspeed HDMI signals without any additional FET switches.
Consumer Electronics Control (CEC)
The Consumer Electronics Control (CEC) line is a high level command and control protocol, based on a single wire multidrop open drain communication bus running at approximately 1kHz (See Figure 3). While the HDMI link provides only a single point-to-point connection, up to ten (10) CEC devices may reside on the bus, and they may be daisy chained out through other physical connectors including other HDMI ports or other dedicated CEC links. The high level protocol of CEC can be implemented in a simple microcontroller or other interface with any I/OD (input/open-drain) GPIO.
CEC RX TX I/OD GPIO
Figure 3. Typical C I/OD Driver To limit possible EMI and ringing in this potentially complex connection topology, the rise- and fall-time of this line are limited by the specification. However, meeting the slew-rate limiting requirements with additional discrete circuitry in this bi-directional block is not trivial without an additional RX/TX control line to limit the output slew-rate without affecting the input sensing (See Figure 4).
CEC RX TX TX_EN Slew Rate Limited 3-State Buffer X
Figure 4. Three-Pin External Buffer Control Simple CMOS buffers cannot be used in this application since the load can vary so much (total pullup of 27k to less than 2k, and up to 7.3nF total capacitance.) The CM2031 targets an output drive slew-rate of less than 100mV/s regardless of static load for the CEC line. Additionally, the same internal circuitry will perform active
Rev. 5 | Page 6 of 18 | www.onsemi.com
CM2031
termination, thus reducing ringing and overshoot in entertainment systems connected to legacy or poorly designed CEC nodes. The CM2031's bi-directional slew rate limiting is integrated into the CEC level-shifter functionality thus allowing the designer to directly interface a simple low voltage CMOS GPIO directly to the CEC bus and simultaneously guarantee meeting all CEC output logic levels and HDMI slew-rate and isolation specifications (See Figure 5).
CEC
CEC I/F P
CM2031
Figure 5. Integrated CM2031 Solution The CM2031 also includes an internal backdrive protected static pullup 120A current source from the CE_SUPPLY rail in addition to the dynamic slew rate control circuitry. Figure 6 shows a typical shaped CM2031 CEC output (bottom) against a ringing uncontrolled discrete solution (top).
Figure 6. CM2031 CEC Output
Rev. 5 | Page 7 of 18 | www.onsemi.com
CM2031
Hotplug Output Pullup Logic
The CM2031 includes flexible circuitry for active or passive control of the HDMI Sink's Hotplug Present Output line by integrating the 1k pullup resistor. Section 8.5 of the HDMI Specification allows the HDMI Sink to pulse the HotPlug line "low" for at least 100msec to indicate to the Source that the EEPROM should be re-read. This function can be implemented with a few discrete components as shown in Figure 7.
Figure 7. Typical Discrete HPD Switching Circuit The Hot Plug Detect circuit of the CM2031 is specifically designed to provide this "pulse" capability and still pass CTS testing requirements. When a logic "high" is applied to the HOTPLUG_DET_IN pin, an internal switch enables the 1k pull-up. When a logic "low" is sensed on this pin, the 1k logic resistor is disconnected, and a weak pulldown ensures a valid low output on the HDMI cable. 5V Passive Pullup In the most basic implementation, where HOTPLUG is to be asserted only when the HDMI +5V supply is applied, simply tie HOTPLUG_DET_IN to the +5V supply and connect HOTPLUG_DET_OUT to HDMI Connector (Pin 19). Local Power Supply Pullup Passive For a system that needs to inhibit the HOTPLUG signal when the local ASIC low voltage supply ("LV_SUPPLY" on CM2031) has been powered, the designer can simply connect HOTPLUG_DET_OUT to the HDMI Connector (Pin 19) and tie HOTPLUG_DET_IN to the "LV_SUPPLY" which can be 1.5V, 1.8V, 2.5V, etc. Then the internal 1k pullup will be enabled between HOTPLUG_DET_OUT and 5V_SUPPLY. If a weak pullup is used on HOTPLUG_DET _IN, then this still allows dynamic switching by the local ASIC while still retaining the isolation/backdrive protection on this pin. Active Local Pullup Control For a system where a low voltage GPIO signal needs to control the HOTPLUG pin (i.e. if the local system needs to boot up before asserting HOTPLUG) the ASIC GPIO can be connected directly to the HOTPLUG_DET_IN pin to control the 5V pullup "on" and "off." A logic "low" on HOTPLUG_DET_IN will disable the 5V pullup, and a logic "high" will enable the pullup. (NOTE: If the ASIC Power-ON Reset {POR} default of the GPIO is high-impedance or defaults to an input, then the designer should include a weak pulldown on the GPIO to eliminate any POR glitches.)
Rev. 5 | Page 8 of 18 | www.onsemi.com
CM2031
Figure 8. Simplified CM2031 HPD Circuit
Rev. 5 | Page 9 of 18 | www.onsemi.com
CM2031
Ordering Information
PART NUMBERING INFORMATION
Pins Package Lead-free Finish Ordering Part Number
1
Part Marking
38
TSSOP-38
CM2031-A0TR
CM2031-A0TR
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
VCC5, VCCLV DC Voltage at any Channel Input Storage Temperature Range
6.0 [GND - 0.5] to [VCC + 0.5] 65 to +150
V V C
STANDARD (RECOMMENDED) OPERATING CONDITIONS
SYMBOL PARAMETER MIN TYP MAX UNITS
5V_SUPPLY LV_SUPPLY CE_SUPPLY
Operating Supply Voltage Bias Supply Voltage Bias Supply Voltage Operating Temperature Range 1 3 40
5 3.3 3.3
5.5 5.5 3.6 85
V V V C
Rev. 5 | Page 10 of 18 | www.onsemi.com
CM2031
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
ICC5
Operating Supply Current
5V_SUPPLY = 5.0V, CEC_OUT = 3.3V, LV_SUPPLY= 3.3V, CE_SUPPLY= 3.3V, DDC=5V; Note 6
300
350
A
ICCLV ICCCE ICEC IOFF IBACKDRIVETMDS IBACKDRIVEDDC
Bias Supply Current Bias Supply Current Current source on CEC pin shifting NFET Current through TMDS pins when powered down Current through DDC_DAT_OUT when pow ered down
LV_SUPPLY = 3.3V; Note 7 CE_SUPPLY=3.3V, CEC_OUT=0V; Notes 6 and 7 CE_SUPPLY=3.3V, HOTPLUG_IN=0V All Supplies = 0V; TMDS_[2:0]+/, TMDS_CK+/ = 4V All Supplies = 0V; DDC_DAT/CLK_OUT = 5V; DDC_DAT/CLK_IN = 0V All Supplies = 0V; HOTPLUG_DET_OUT = 5V; HOTPLUG_IN = 0V CE-REMOTE_IN = CE_SUPPLY < 111
60 60 120 0.1 0.1 0.1
150 150 128 5 5 5
A A
A A
OFF state leakage current, level LV_SUPPLY=0V; Note 2
A
A
IBACKDRIVEHOTPLUG Current through HOTPLUG_DET_OUT when powered down IBACKDRIVECEC Current through CEdown CECSL CECRT CEC Slew Limit CEC Rise Time
0.1
5
A
0.1
1.8
A
REMOTE_OUT when powered CE_REMOTE_OUT Measured from10-90% or 90-10% Measured from 10-90% Assumes a signal swing from 03.3V CECFT CEC Fall Time Measured from 90-10% Assumes a signal swing from 03.3V RHOTPLUG VTH VACC VON(DDC_OUT) Hotplug Resistance Threshold Voltage to Assert 1k Turn On Threshold of I2C/DDC Voltage is 0.3 X 5V_Supply; Note 2 Accelerator Voltage drop across DDC level LV_SUPPLY=3.3V, 3mA Sink at shifter DDCIN, DDCOUT < VACC 150 225 mV 1.35 1.5 1.65 V Voltage on HotPlug_In is greater than the specified range below 1.5 5.5 V 0.8 1 1.2 k 4 50
s
0.26 26.4
0.65 250
V/s
s
Rev. 5 | Page 11 of 18 | www.onsemi.com
CM2031
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VOL(DDC_IN)
Logic Level (ASIC side) when I2C/DDC Logic Low Applied;
(I2C pass-through compatibility)
DDC_OUT=0.4V, LV_SUPPLY=3.3V, 1.5k pullup on DDC_OUT to 5.0V DDC_IN floating, LV_SUPPLY=3.3V, 1.5k pullup on DDC_OUT to 5.0V, Bus Capacitance = 1500pF IF = 8mA, TA = 25 Note 2 C; 0.6 0.6 Pins 4, 7, 10, 13, 20, 21, 22, 23, 24, 27, 30, 33, TA = 25 Note 2 C;
0.3
0.4
V
tr(DDC)
DDC_OUT Line Risetime, VACC < VDDC_OUT < (5V_Supply-0.5V)
1
s
VF
Diode Forward Voltage Top Diode Bottom Diode
0.85 0.85
0.95 0.95
V V kV kV
VESD VESD VCL
ESD Withstand Voltage (IEC)
8 2
ESD Withstand Voltage (HBM) Pins 1, 2, 16, 17, 18, 19, 37, and 38, TA = 25 Note 3 C; Channel Clamp Voltage Positive Transients Negative Transients TA=25 IPP=1A, tP=8/20S; C, Note 5
11.0 2.0
V V
RDYN
Dynamic Resistance Positive Transients Negative Transients
TA=25 IPP=1A, tP=8/20S C, Any I/O pin to Ground; Note 5 TA = 25 C 1.4 0.9 0.01 1
A
ILEAK
TMDS Channel Leakage Current
CIN, TMDS
TMDS Channel Input Capacitance TMDS Channel Input Capacitance Matching
5V_SUPPLY=5.0V, Measured at 1MHz, VBIAS=2.5V 5V_SUPPLY=5.0V, Measured at 1MHz, VBIAS=2.5V; Note 4 5V_SUPPLY=0V, Measured at 1MHz, VBIAS=2.5V 5V_SUPPLY=0V, Measured at 100KHz, VBIAS=2.5V
0.9 0.05
1.2
pF pF
CIN, TMDS
CMUTUAL
Mutual Capacitance between signal pin and adjacent signalpin
0.07
pF
CIN, DDCOUT
Level Shifting Input Capacitance, Capacitance to GND
10
pF
Rev. 5 | Page 12 of 18 | www.onsemi.com
CM2031
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX UNITS
CIN, CECOUT
Level Shifting Input Capacitance, Capacitance to GND
5V_SUPPLY=0V, Measured at 100KHz, VBIAS=1.65V 5V_SUPPLY=0V, Measured at 100KHz, VBIAS=2.5V; Note 2
10
pF
CIN, HPOUT
Level Shifting Input Capacitance, Capacitance to GND
10
pF
Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified. Note 2: Standard IEC61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330, 5V_SUPPLY=5V, 3.3V_SUPPLY=3.3V, LV_SUPPLY=3.3V, GND=0V. Note 3: Human Body Model per MIL-STD-883, Method 3015, CDISCHARGE=100pF, RDISCHARGE=1.5k, 5V_SUPPLY=5V, 3.3V_SUPPLY=3.3V, LV_SUPPLY=3.3V, GND=0V. Note 4: Intra-pair matching, each TMDS pair (i.e. D+, D-). Note 5: These measurements performed with no external capacitor on VP (VP floating). Note 6: These static measurements do not include AC activity on controlled I/O lines. Note 7: This measurement does not inclue supply current for the 120A current source on the CEC pin.
Rev. 5 | Page 13 of 18 | www.onsemi.com
CM2031
Performance Information
Typical Filter Performance (TA=25 DC Bias=0V, 50 Ohm Environment) C,
Figure 9. Insertion Loss vs. Frequency (TMDS_D1- to GND)
Rev. 5 | Page 14 of 18 | www.onsemi.com
CM2031
Application Information
NO T E 4
RO PT
NOTE 6 NOTE 7 NOTE 5 5 NOTE
Figure 10. Typical Application for CM2031
LAYOUT NOTES Differential TMDS Pairs should be designed as normal 100 HDMI Microstrip. Single Ended (decoupled) TM TM TMDS traces underneath MediaGuard ,and traces between MediaGuard and Connector should be TM tuned to match chip/connector IBIS parasitics. (See MediaGuard Layout Application Notes.)
1 2
Level Shifter signals should be biased with a weak pullup to the desired local LV_SUPPLY. If the local ASIC includes
sufficient pullups to register a logic high, then external pullups may not be needed.
3
Place MediaGuard as close to the connector as possible, and as with any controlled impedance line always avoid placing
TM
any silkscreen printing over TMDS traces.
4
CM2021/CM2031 footprint compatibility - For the CM2031, Pin 37 becomes the V power supply pin for the slew-rate limiting
CEC
circuitry.
This can be supplied by a 0 jumper to VCEC which should be depopulated to utilize the CM2021. The 100nF C is
BYP
recommended for all applications.
5
CEC pullup isolation - The 27k RCEC and a Schottky DCEC provide the necessary isolation for the CEC pullup.
Rev. 5 | Page 15 of 18 | www.onsemi.com
CM2031
Note:
This circuitry is used only in the CM2021. Depopulate the components for CM2031 applications in a CM2021/ CM2031 dual
footprint layout.
6
Footprint compatibility - The CM2031 has (built-in) internal backdrive protection.
The CM2021 does not not have internal backdrive protection and requires the external RCEC and DCEC components.
7
(For CM2031) If CEC firmware is not implemented, do not populate with 0 resistor. If CEC firmware is implemented, then
populate with 0 resistor. (For CM2021) Populate with 0 resistor in either case.
Application Information (cont'd)
Design Considerations DUT On vs. DUT Off Many HDMI CTS tests require a power off condition on the System Under Test. Many discrete ESD diode configurations can be forward baised when their VDD rail is lower than the I/O pin bias, thereby exhibiting extremely high apparent capacitance measurements, for example. The MediaGuard backdrive isolation circuitry limits this current to less than 5A, and will help ensure HDMI compliance.
Please review all of the current HDMI design guidelines available at:
http://www.calmicro.com/applications/customer/downloads/current-cmd-mediaguard-design-guidelines.zip
Rev. 5 | Page 16 of 18 | www.onsemi.com
CM2031
Mechanical Details
TSSOP-38 Mechanical Specifications CM2031 devices are supplied in 38-pin TSSOP packages. Dimensions are presented below. For complete information on the TSSOP-38, see the California Micro Devices TSSOP Package Information document.
Mechanical Package Diagrams
PACKAGE DIMENSIONS
Package JEDEC No. Pins Dimensions A A1 b c D E E1 e L # per tape and reel Millimeters Min Max Min
TSSOP MO-153 (Variation BD-1) 38
38 37 36 35 34 33 32 31 30 TOP VIEW
D
29 28 27 26 25 24 23 22 21 20
Inches Max
-- 0.05 0.17 0.09 9.60 4.30 0.45
1.20 0.15 0.27 0.20 9.80 4.50 0.75
-- 0.002 0.007 0.004 0.378 0.169 0.018
0.047 0.006 0.011 0.008 0.386 0.177
E
Pin 1 Marking
E1
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15
16
17
18
19
6.40 BSC 0.50 BSC
0.252 BSC
SIDE VIEW
0.020 BSC 0.030
SEA ING T PLANE
A A1 b e
2500 pieces
Controlling dimension: millimeters
END VIEW
c
L
Package Dimensions for TSSOP-38
Rev. 5 | Page 17 of 18 | www.onsemi.com
CM2031
Tape and Reel Specifications
PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1
CM2031
9.70 X 6.40 X 1.20
10.20 X 6.90 X 1.80
16mm
330mm (13")
2500
4mm
12mm
Po T op Cover T ape
10 Pitches Cumulative T olerance On ape T 0.2 mm
Ao W Bo
Ko For t pe feeder reference a only including draf t. Concentric around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
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